The Teledyne FLIR Boson® and Boson®+ series set the standard for longwave infrared (LWIR) thermal imaging, offering exceptional performance in a compact form factor. Designed for seamless integration into a variety of systems, these modules are ideal for applications requiring high-resolution thermal imaging with minimal size, weight, and power consumption. Key Features: High-Resolution Imaging: Available in 640×512 (VGA) and 320×256 (QVGA) resolutions with a 12 µm pixel pitch, delivering detailed thermal imagery. Enhanced Thermal Sensitivity: Boson®+ offers industry-leading thermal sensitivity of ≤20 mK, providing superior image quality in challenging environments. Compact and Lightweight: Measuring 21×21×11 mm and weighing as little...

The Teledyne FLIR Boson® and Boson®+ series set the standard for longwave infrared (LWIR) thermal imaging, offering exceptional performance in a compact form factor. Designed for seamless integration into a variety of systems, these modules are ideal for applications requiring high-resolution thermal imaging with minimal size, weight, and power consumption.

Key Features:

• High-Resolution Imaging: Available in 640×512 (VGA) and 320×256 (QVGA) resolutions with a 12 µm pixel pitch, delivering detailed thermal imagery.

• Enhanced Thermal Sensitivity: Boson®+ offers industry-leading thermal sensitivity of ≤20 mK, providing superior image quality in challenging environments.

• Compact and Lightweight: Measuring 21×21×11 mm and weighing as little as 7.5 grams, these modules are optimized for applications where space and weight are critical.

• Low Power Consumption: Starting at 500 mW, suitable for battery-powered and mobile platforms.

• Versatile Integration: Supports multiple video interfaces, including USB, CMOS, and MIPI, ensuring compatibility with a wide range of processors and systems.

• Radiometric Capability: Select models offer radiometric functionality, enabling precise temperature measurements for industrial and scientific applications.

• Rugged Design: Operates reliably in temperatures ranging from -40°C to +80°C, suitable for harsh environments.

Applications:

Ideal for integration into unmanned systems (UAVs, UGVs), security and surveillance equipment, industrial inspection tools, and handheld devices where high-quality thermal imaging is essential.

Explore our collection to find the Boson® or Boson®+ module that best fits your project's requirements.

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