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OEM Camera Interface Module

Low Profile BOSON VPC3 Interface Module with USB3

Low Profile BOSON VPC3 Interface Module with USB3

  • Interface Type: VPC3 (Video, Power & Communication)
  • Power Input: 5 to 26 V DC
  • Power Protection: Reverse polarity protected
  • USB Video Support: Yes
  • Video Output: USB 3.0
  • Control Channels: USB 3.0 (Video + Control)
  • Mounting Features: Four M1.6 holes
  • Operational Altitude: Up to 12 km
  • Operating Temperature Range: –40°C to 80°C
  • Storage Temperature Range: –50°C to 105°C
  • Power Dissipation: <0.1 W (camera not included), 3.5 W max with camera, 6 W total fused
  • Included Accessories: 1.5 mm hex L-key, 2-pin JST to flying leads, 3 ft USB-A to USB-C cable, heatsink cover, interface board, M1.6 screws

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Regular price $183.00 USD
Regular price $183.00 USD Sale price $183.00 USD
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Shipping calculated at checkout.

SKU: RHP-BOS-VPC3-IF-1

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Product Information

Low Profile BOSON VPC3 Interface Module with USB3

The Low Profile BOSON VPC3 Interface Module with USB3 (SKU: RHP-BOS-VPC-IF-USB3) is a powerful and compact Video Power Communication solution engineered for seamless integration with the Teledyne FLIR Boson thermal camera. Designed with enhanced heat dissipation for high-demand environments, this module supports power input ranging from 5 to 26V DC and includes reverse polarity protection for added safety. It offers full USB3 support for both power and high-speed video streaming, allowing users to stream video directly to a PC with minimal latency. The module also includes Sync-In/Out functionality, enabling precise device coordination in multi-sensor systems. Built for performance and reliability, the BOSON VPC3 Interface Module with USB3 is ideal for professionals requiring robust connectivity in a low-profile form factor. We usually have a majority of these items in stock. If unsure, please call or contact us for availability.

Compact Interface Module for FLIR Boson Integration

The Low Profile BOSON VPC3 Interface Module with USB3 is engineered to facilitate seamless integration of Teledyne FLIR Boson thermal cores into various systems. Its compact design ensures minimal space usage, making it ideal for applications where size and weight are critical factors. This module provides essential connectivity for video, power, and communication interfaces, streamlining the integration process.

Enhanced Connectivity with USB3 Support

Equipped with USB3 capabilities, this interface module allows for high-speed data transfer, enabling real-time video streaming and efficient communication with host systems. The module supports both USB2.0 and USB3.0 standards, ensuring compatibility with a wide range of devices and facilitating flexible integration options.

Robust Power Management and Protection Features

Designed to operate within a 5 to 26 Volts DC input range, the module includes reverse polarity protection to safeguard against incorrect power connections. This feature enhances the reliability and safety of the system, ensuring consistent performance in various operating conditions.

Versatile Applications Across Industries

The Low Profile BOSON VPC3 Interface Module with USB3 is suitable for a broad spectrum of applications, including aerial surveillance, industrial inspection, and scientific research. Its compact form factor, combined with robust connectivity and power management features, makes it a valuable component for systems requiring high-quality thermal imaging capabilities.

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Export Restrictions

The information contained in this page pertains to products that may be subject to the International Traffic in Arms Regulations (ITAR) (22 C.F.R. Sections 120-130) or the Export Administration Regulations (EAR) (15 C.F.R. Sections 730-774) depending upon specifications for the final product; jurisdiction and classification will be provided upon request.